Nepes corporation, founded in 1990, has been providing bumping and wafer-level package OSAT manufacturing services in partner ... ship with Fabless and IDM customers worldwide since 2001. Nepes offers turn-key solution of IC backend service for 8″ and 12″ wafer with reliable quality by implementing mainstream technology from the wafer bumping, IC packaging and testing. The Company’s portfolio of products covers Wafer level package(WLP), System in package(SiP) and Fan-out panel level package(FOPLP). Nepes has manufacturing sites in South Korea and China and international sales offices in San Diego, CA, Shanghai, China and Taiwan. read more